Instrumentation Equipment
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The equipment available for use in the microelectronics laboratories, Texas A&M University is summarized below. Measurement capabilities are stressed, rather than specific equipment models. There exists facilities and equipment for dicing wafers, die bonding and wire bonding. There are several wafer probe stations for test; one with equipment for ultrasonic cutting. Finally, there is a high performance microscope with a color camera and monitor for visual inspection of IC chips.
In terms of actual test equipment, there are two categories. First, there are multiple setups composed of the standard laboratory equipment. These include high bandwidth oscilloscopes, power supplies, multimeters, function generators, counters and related equipment. The other category of test equipment is the automated data acquistion system.
This system revolves around a PC, which serves as HPIB instrument controllers. There are instrumentation and software for performing several types of measurements. Gain/phase transfer functions and impedance analysis may be performed over a wide range of frequencies, from DC through 3 Ghz. Included in these measurements is a 3 Ghz HP Network Analyzer with an @-parameter test fixture. Circuits or devices are characterized by the r S-parameters from which other useful information may be derived. Other measurement capabilities include spectrum analysis, waveform digitization, highly precise measurement of small current (10E-15) and voltage (10E-9) and measurement of noise down to frequencies of 1 mHz.
Instrumentation and Controllers for Evaluation of Microelectronic Circuits
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